06005773 is referenced by 45 patents and cites 10 patents.

A power supply module package suitable for both high packaged power density and cost effective manufacture. In an exemplary embodiment, the power supply module includes: (1) at least one printed circuit board containing conductors for interconnecting components of the power supply, (2) a thermally conductive baseplate or case operable for transferring heat generated inside the module to the outside environment, wherein the external package dimensions are of a sufficiently small size to allow the user the greatest flexibility in the design of the overall circuit assembly, (3) at least one power magnetic device operable for providing electrical isolation between the input and the output of the power module, and (4) a set of electrical leads to facilitate communication and power flow between the module and circuitry being powered. The present invention provides a highly compact, thermally conductive package for a power supply module (perhaps a DC/DC converter) that is cost effective, readily manufacturable, durable, and easily mounted to a circuit card, allowing the power module to, for example, form a portion of a distributed power architecture.

Title
Board-mountable power supply module
Application Number
772681
Publication Number
6005773
Application Date
June 20, 1997
Publication Date
December 21, 1999
Inventor
David Leonard Stevens
Mesquite
TX, US
Allen Frank Rozman
Richardson
TX, US
Agent
Craig J Cox
Lester H Birnbaum
Robert R Axenfeld
Assignee
Lucent Technologies
NJ, US
IPC
H05K 7/20
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