05994152 is referenced by 245 patents and cites 465 patents.

Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate establishes a predetermined spatial relationship between the interconnection elements which may be composite interconnection elements having a relatively soft elongate element as a core and a relatively hard (springy material) overcoat. Tip structures fabricated on sacrificial substrates may be provided with a surface texture optimized for mounting to any interconnection elements for making pressure connections to terminals of electronic components. Interconnection elements may be fabricated upon such tip structures, or may first be mounted to the electronic component and the tip structures joined to the free-ends of the interconnection elements. Tip structures formed as cantilever beams are described.

Title
Fabricating interconnects and tips using sacrificial substrates
Application Number
152812
Publication Number
5994152
Application Date
January 24, 1997
Publication Date
November 30, 1999
Inventor
Gaetan L Mathieu
Dublin
CA, US
Benjamin N Eldridge
Danville
CA, US
Igor Y Khandros
Livermore
CA, US
Agent
Daivd Larwood
Gerald Linden
Assignee
FormFactor
CA, US
IPC
H05K 3/36
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