Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate establishes a predetermined spatial relationship between the interconnection elements which may be composite interconnection elements having a relatively soft elongate element as a core and a relatively hard (springy material) overcoat. Tip structures fabricated on sacrificial substrates may be provided with a surface texture optimized for mounting to any interconnection elements for making pressure connections to terminals of electronic components. Interconnection elements may be fabricated upon such tip structures, or may first be mounted to the electronic component and the tip structures joined to the free-ends of the interconnection elements. Tip structures formed as cantilever beams are described.