05990566 is referenced by 168 patents and cites 10 patents.

A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. The polymer interconnect includes a flexible polymer tape with patterns of conductors. The conductors include microbumps for bonding to the die bond pads, and edge contacts for electrical connection to mating contacts on the substrate. The package also includes a force applying mechanism for biasing the dice against the substrate. In alternate embodiments, the polymer interconnect includes resilient edge contacts, cantilevered edge contacts, or multi level edge contacts.

Title
High density semiconductor package
Application Number
9/82093
Publication Number
5990566
Application Date
May 20, 1998
Publication Date
November 23, 1999
Inventor
Eugene Cloud
Boise
ID, US
Mike Brooks
Caldwell
ID, US
Alan G Wood
Boise
ID, US
Salman Akram
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
H01L 29/40
H01L 23/52
H01L 23/48
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