05990546 is referenced by 90 patents and cites 5 patents.

A semiconductor device in which the space between a semiconductor chip and an auxiliary wiring plate is sealed with resin. The auxiliary wiring plate has insulating layers and on both sides of the routing conductor, the insulating layer on the side of the semiconductor chip has a hole being led from the routing conductor to the electrode of the semiconductor chip, the metal filled in the hole and the metal bump formed so as to protrude from the hole serves as an inner electrode. The semiconductor device can be manufactured by the TAB technique.

Title
Chip scale package type of semiconductor device
Application Number
8/581260
Publication Number
5990546
Application Date
December 29, 1995
Publication Date
November 23, 1999
Inventor
Hisataka Ito
Osaka
JP
Nobuhiko Yoshio
Osaka
JP
Hideyuki Usui
Osaka
JP
Satoshi Tanigawa
Osaka
JP
Megumu Nagasawa
Osaka
JP
Kazumasa Igarashi
Osaka
JP
Agent
Sughrue Mion Zinn Macpeak & Seas PLLC
Assignee
Nitto Denko Corporation
JP
IPC
H01L 23/053
View Original Source