05989982 is referenced by 42 patents and cites 7 patents.

Disclosed herein is a method of manufacturing a semiconductor device, according to the present invention, wherein a wafer is divided into individual fractions by a diamond blade, the entire surface of the wafer, which include gaps between the respective fractions, is thereafter sealed with a resin, and the wafer is divided into individual fractions again by a diamond blade narrower than another diamond blade in width, whereby a chip size package in which the resin is being left on one sides of a chip, can be obtained. According to the method referred to above, a chip size package in which chip sides are also sealed with the resin, can be easily manufactured.

Title
Semiconductor device and method of manufacturing the same
Application Number
8/967022
Publication Number
5989982
Application Date
November 10, 1997
Publication Date
November 23, 1999
Inventor
Takahashi Yoshikazu
Tokyo
JP
Agent
Jones Volentine
Assignee
Oki Electric
JP
IPC
H01L 21/301
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