05980270 is referenced by 168 patents and cites 68 patents.

A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.

Title
Soldering with resilient contacts
Application Number
254991
Publication Number
5980270
Application Date
November 26, 1996
Publication Date
November 9, 1999
Inventor
John W Smith
Palo Alto
CA, US
Thomas H DiStefano
Monte Sereno
CA, US
Joseph Fjelstad
Sunnyvale
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01R 9/09
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