05977640 is referenced by 264 patents and cites 14 patents.

The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.

Title
Highly integrated chip-on-chip packaging
Application Number
9/105419
Publication Number
5977640
Application Date
June 26, 1998
Publication Date
November 2, 1999
Inventor
Edmund Juris Sprogis
Underhill
VT, US
Wayne John Howell
Williston
VT, US
Thomas George Ference
Essex Junction
VT, US
Claude Louis Bertin
South Burlington
VT, US
Agent
Schmeiser Olsen & Watts
Agent
Howard J Walter Jr
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 23/48
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