05977627 is referenced by 3 patents and cites 5 patents.

A novel IC chip packaging construction in which the chip package materials are selected such that their thermal linear expansion curves are closely matched over the full operating temperature range of the IC chip. The IC chip packaging construction includes a metal base and cover for enclosing the IC chip and a pair of insulating frames for hermetically sealing the IC chip in the chip package. A plurality of input/output leads make electrical connections with the IC chip through fine wires that are soldered to the leads and to contact areas on the IC chip. The metal base and cover and the input/output leads are fabricated from copper and the insulating frames are fabricated from Fotoceram.RTM. 160, which has a thermal linear expansion curve that closely matches that of copper over the full operating temperature range of the chip. Accordingly, the problems of differential expansion rates due to temperature variations for wafer size or very large scale IC chips are greatly minimized.

Title
Packaging construction for very large scale integrated-circuit chips
Application Number
944124
Publication Number
5977627
Application Date
January 30, 1989
Publication Date
November 2, 1999
Inventor
Robert Smolley
Portuguese Bend
CA, US
Agent
Michael S Yatsko
Assignee
TRW
CA, US
IPC
H01L 21/50
H01L 21/44
H01L 23/02
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