05973392 is referenced by 101 patents and cites 19 patents.

A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the through-holes connected to the circuit pattern. The semiconductor device unit also includes at least one semiconductor memory chip mounted on the carrier such that the semiconductor memory chip is connected to the circuit pattern, and at least one chip select semiconductor chip mounted on the carrier to be connected to the circuit pattern such that the chip select semiconductor chip can select the semiconductor memory chip.

Title
Stacked carrier three-dimensional memory module and semiconductor device using the same
Application Number
9/33674
Publication Number
5973392
Application Date
March 3, 1998
Publication Date
October 26, 1999
Inventor
Katsumasa Hashimoto
Tokyo
JP
Makoto Ohtsuka
Tokyo
JP
Hideki Kusamitu
Tokyo
JP
Ikusi Morizaki
Tokyo
JP
Yuzo Shimada
Tokyo
JP
Naoji Senba
Tokyo
JP
Agent
Young & Thompson
Assignee
NEC Corporation
JP
IPC
H05K 7/20
H01L 23/34
H01L 27/00
H01L 27/14
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