05966593 is referenced by 16 patents and cites 34 patents.

The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base, a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.

Title
Method of forming a wafer level contact sheet having a permanent z-axis material
Application Number
8/748112
Publication Number
5966593
Application Date
November 8, 1996
Publication Date
October 12, 1999
Inventor
Jimmy Leong
Eau Claire
WI, US
John J Budnaitis
Eau Claire
WI, US
Agent
Victor M Genco Jr
Assignee
W L Gore & Associates
DE, US
IPC
H01L 21/44
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