05959846 is referenced by 128 patents and cites 10 patents.

First and second electrically insulating substrates are joined with each other at respective joining faces thereof. Each of the first and second insulating substrates has an annular groove at the joining face, and a plurality of through holes along outer and inner peripheries of the annular groove. An annular core is mounted in the annular groove. A cylindrical connection is formed in each through hole, and a radial connection is formed on an outer surface of each insulating substrate so as to connect opposite cylindrical connections. A toroidal coil is formed by serially connecting cylindrical connections and radial connections. An IC chip is mounted on the outer surface of the first insulating substrate, and connected to the toroidal coil and electronic part. The toroidal coil and the electronic part are coated with an electrically insulating material.

Title
Modular surface mount circuit device and a manufacturing method thereof
Application Number
8/997485
Publication Number
5959846
Application Date
December 23, 1997
Publication Date
September 28, 1999
Inventor
Yosio Murano
Yamanashi-ken
JP
Masashi Miyashita
Yamanashi-ken
JP
Kathuhiko Noguchi
Yamanashi-ken
JP
Agent
Dennison Meserole Scheiner & Schultz
Assignee
Citizen Electronics
JP
IPC
H05K 7/02
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