05959460 is referenced by 4 patents and cites 6 patents.

An apparatus for probing high frequency electronic devices in wafer form comprising a high frequency wafer probe (16,56) having a conductor (36,61), a dielectric layer (37,71,72), a grounding layer (38,81,82,91), a signal probe needle (39,86), and a pair of ground needles (43,72,76) coupled to a substrate (11,51). A plurality of high frequency wafer probes (16,56) can be coupled to the substrate (11,51) to probe high density high frequency electronic devices and to probe high frequency electronic devices having varying bonding pad layouts. The high frequency wafer probe (16,56) is less sensitive to varying bonding pad height. The apparatus is suitable for probing high frequency electronic devices in a wafer manufacturing environment.

Title
High frequency stripline blade probe device and method of probing
Application Number
265876
Publication Number
5959460
Application Date
September 5, 1995
Publication Date
September 28, 1999
Inventor
Scott V Johnson
Scottsdale
AZ, US
Agent
Kevin B Jackson
Assignee
Motorola
IL, US
IPC
G01R 31/00
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