05948514 is referenced by 35 patents and cites 16 patents.

A photocurable and thermosetting resin composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination: (A) a photosensitive prepolymer soluble in a dilute aqueous alkali solution obtained by esterifying an epoxy resin represented by the following general formula (1) with (meth)acrylic acid and further adding an acid anhydride thereto until an acid value reaches a level in the range of 60 to 120 mg KOH/g, (B) a diglycidyl ether type epoxy compound containing two epoxy groups in the molecular unit thereof, (C) a photopolymerization initiator, and (D) a diluent at such ratios of combination that said epoxy compound (B) accounts for a proportion in the range of 5 to 120 parts by weight and said photopolymerization initiator (C) for a proportion in the range of 0.1 to 30 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A): ##STR1## wherein X represents CH.sub.2, C(CH.sub.3).sub.2, or SO.sub.2, n is an average value in the range of 1 to 12, and Y represents a hydrogen atom or a glycidyl group, providing that Y is a glycidyl group where n is 1 and at least one of the plurality of Y's is a glycidyl group where n is 2 or more.

Title
Photocurable thermosettting resin composition developable with aqueous alkali solution
Application Number
8/658446
Publication Number
5948514
Application Date
June 5, 1996
Publication Date
September 7, 1999
Inventor
Miyako Juni
Sakado
JP
Masao Arima
Sakado
JP
Kazuo Suda
Ome
JP
Shigeru Komori
Konosu
JP
Agent
Rader Fishman & Grauer
Agent
Ronald P Kananen
Assignee
Taiyo Ink Manufacturing
JP
IPC
C09D 163/02
C08G 59/17
C08G 59/14
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