05936707 is referenced by 30 patents and cites 22 patents.

A method is providing for making a multi-level reticle which transmits a plurality of incident light intensities, which in turn, are used to form a plurality of thicknesses in a photoresist profile. A partially transmitting film, used as one of the layers of the reticle, is able to provide an intermediate intensity light. The intermediate intensity light has an intensity approximately midway between the intensity of the unattenuated light passing through the reticle substrate layer, and the totally attenuated light blocked by an opaque layer of the reticle. The exposed photoresist receives light at two intensities to form a via hole in the resist in response to the higher intensity light, and a connecting line to the via at an intermediate level of the photoresist in response to the intermediate light intensity. A method for forming the multi-level resist profile from the multi-level reticle is provided as well as a multi-level reticle apparatus.

Title
Multi-level reticle system and method for forming multi-level resist profiles
Application Number
660870
Publication Number
5936707
Application Date
January 16, 1998
Publication Date
August 10, 1999
Inventor
David Russell Evans
Beaverton
OR, US
Bruce Dale Ulrich
Beaverton
OR, US
Tue Nguyen
Vancouver
WA, US
Agent
David C Ripma
Gerald Maliszewski
Assignee
Sharp Kabushiki Kaisha
JP
Sharp Laboratories of America
WA, US
IPC
G03B 27/04
G03B 27/28
G03B 27/00
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