05929517 is referenced by 111 patents and cites 48 patents.

Semiconductor chip packages and methods of fabricating the same. The package includes a thermally conductive protective structure having an indentation open to a front side and a flange surface at least partially surrounding the indentation and facing to the front of the structure. A chip is disposed in the indentation so that the front surface of the chip, with contacts thereon, faces toward the front of the structure. A flexible dielectric film having terminals thereon is placed on the flange surface, and a compliant material is disposed between the film and the flange surface. The terminals on the film are connected to the contacts on the chip. The individual terminals on the film are movable with respect to the protective structure, which facilitates mounting and compensation for thermal expansion.

Title
Compliant integrated circuit package and method of fabricating the same
Application Number
8/365749
Publication Number
5929517
Application Date
December 29, 1994
Publication Date
July 27, 1999
Inventor
John W Smith
Palo Alto
CA, US
Craig Mitchell
Santa Clara
CA, US
Konstantine Karavakis
Cupertino
CA, US
Thomas H Distefano
Monte Sereno
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H05K 13/04
H01L 23/04
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