05920764 is referenced by 85 patents and cites 9 patents.

A process applicable to the restoration of defective or rejected semiconductor wafers to a defect-free form uses etchants and a variation of the Smart-Cut.RTM. process. Because of the use of the variation on the Smart-Cut.RTM. process, diffusion regions are removed without significantly affecting the specifications of the semiconductor wafer. Therefore, a defective or rejected wafer can be restored to near original condition for use in semiconductor manufacturing.

Title
Process for restoring rejected wafers in line for reuse as new
Application Number
8/940723
Publication Number
5920764
Application Date
September 30, 1997
Publication Date
July 6, 1999
Inventor
Kris V Srikrishnan
Wappingers Falls
NY, US
Hance H Huston III
Fishkill
NY, US
David R Hanson
Brewster
NY, US
Agent
Ratner & Prestia
Agent
Tiffany L Townsend
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/00
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