05892288 is referenced by 42 patents and cites 5 patents.

To provide a slim and miniaturized semiconductor integrated circuit device which eliminates the needs for making through holes and conducting in through holes and uses a carrier substrate with a small thermal expansion coefficient difference from a semiconductor chip. A semiconductor integrated circuit device using a carrier substrate having a plurality of extraction conductive layers 3 formed as a single layer on an insulating base body 11 having a thermal expansion coefficient of 4.times.10.sup.-6 .degree. C..sup.-1 to 16.times.10.sup.-6 .degree. C..sup.-1 and comprising a plurality of ball-like external connection terminals 7 in a plurality of closed-end holes 15 arriving at external connection parts 4, each of the external connection terminals 7 having a diameter larger than the depth of each of the closed-end holes 15.

Title
Semiconductor integrated circuit device
Application Number
8/996143
Publication Number
5892288
Application Date
December 22, 1997
Publication Date
April 6, 1999
Inventor
Takayuki Yuyama
Tokyo
JP
Takeshi Muraki
Tokyo
JP
Agent
McDermott Will & Emery
Assignee
Mitsubishi Denki Kabushiki Kaisha
JP
IPC
H01L 23/52
H01L 23/48
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