Top die pads are electrically relocated by forming holes through a semiconductor wafer between device active regions. An electrically insulating layer is formed over all exposed surfaces of the wafer, including within the holes, and openings are made in the insulating layer for access to the top interconnection pads. The wafer and holes are metallized and patterned to form bottom interconnection pads electrically connected to corresponding top interconnection pads by metallization extending within the holes. A dicing saw having a kerf width less than the diameter of the holes is employed to separate the individual devices. For accurate position alignment of repatterned die, an alignment structure, such as projecting pins or an egg crate structure, engages the die, and alignment pads can be patterned on the die.