05870823 is referenced by 114 patents and cites 20 patents.

Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating electronic device placed on the sintered body. Also disclosed is a method of making the electronic packaging substrate.

Title
Method of forming a multilayer electronic packaging substrate with integral cooling channels
Application Number
8/756362
Publication Number
5870823
Application Date
November 27, 1996
Publication Date
February 16, 1999
Inventor
Glenn A Pomerantz
Kerhonkson
NY, US
John B Pavelka
Austin
TX, US
Jon A Casey
Poughkeepsie
NY, US
Raschid J Bezama
Mahopac
NY, US
Agent
Ira D Blecker
Assignee
International Business Machines Corporation
NY, US
IPC
H05K 3/46
H05K 3/22
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