05870289 is referenced by 218 patents and cites 4 patents.

A structure for connecting an integrated circuit chip to a wiring substrate which implements high-density packaging, high-density connection, high-speed signal transmission, and low cost. An integrated circuit is connected to a wiring substrate by means of flip-chip die bonding using an adhesive film. A direct through-hole connection is formed directly below a connecting pad so as to pass through the adhesive film and the wiring substrate. This direct through-hole connection directly connects the connecting pad to the wire. As a result of reduced area and thickness of the chip, the chip is mounted in high density, and high-density inputs and outputs are implemented by means of minute two-dimensional connections. Short wire connections directly connected to the chip permit high speed signal transmission, and high reliability is ensured by the dispersion of stress. Low-cost packaging can be effected by simple processes and facilities.

Title
Chip connection structure having diret through-hole connections through adhesive film and wiring substrate
Application Number
8/572747
Publication Number
5870289
Application Date
December 14, 1995
Publication Date
February 9, 1999
Inventor
Mitsuo Usami
Akishima
JP
Yuuji Fujita
Koganei
JP
Masayoshi Yagyu
Hannou
JP
Hiroyuki Itoh
Akiruno
JP
Takeshi Kato
Akishima
JP
Masahide Tokuda
Ome
JP
Agent
Antonelli Terry Stout & Kraus
Assignee
Hitachi
JP
IPC
H05K 7/06
H05K 7/02
H05K 1/16
H05K 1/14
View Original Source