05861666 is referenced by 219 patents and cites 33 patents.

An assembly of semiconductor chips has the chips vertically stacked above one another. Interposers extending between adjacent chips have compliant layers to accommodate thermal expansion of the chips. Desirably, the interposers have metallic plates to conduct heat from the interior of the stack.

Title
Stacked chip assembly
Application Number
8/705309
Publication Number
5861666
Application Date
August 29, 1996
Publication Date
January 19, 1999
Inventor
Pieter H Bellaar
Baambrugge
NL
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/34
H01L 23/48
H01L 23/02
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