05858198 is referenced by 4 patents and cites 9 patents.

A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for the metal cladding on the substrate to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.

Title
Electroplating process
Application Number
588745
Publication Number
5858198
Application Date
September 8, 1997
Publication Date
January 12, 1999
Inventor
Mark J Kapeckas
Worcester
MA, US
Edward C Couble
Brockton
MA, US
Carl J Colangelo
New Bedford
MA, US
Jeffrey P Burress
Milford
MA, US
Steven M Florio
Hopkinton
MA, US
Agent
Darryl P Frickey
Peter F Corless
Robert L Goldberg
Assignee
Shipley Company L L C
MA, US
IPC
C25D 5/48
C25D 5/54
C25D 5/02
C23C 28/00
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