05842273 is referenced by 39 patents and cites 16 patents.

A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complete curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing the interconnect. After assembly, un-filled underfill shrinks sufficiently to compress compliant adhesive and external clamping is largely eliminated. The method is scalable as low as about 6 mils with no real upper limit according to the percentage conductive particles by volume in the adhesive.

Title
Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
Application Number
8/592042
Publication Number
5842273
Application Date
January 26, 1996
Publication Date
December 1, 1998
Inventor
Wayne C Schar
Portola Valley
CA, US
Assignee
Hewlett Packard Company
CA, US
IPC
H01B 1/22
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