05840629 is referenced by 118 patents and cites 34 patents.

There is described a slurry for use in chemical mechanical polishing of copper layers in integrated circuit fabrication. The slurry includes a chromate oxidant, such as sodium chromate tetrahydrate (Na.sub.2 CrO.sub.4.4H.sub.2 O). The chromate oxidant provides a slightly basic slurry solution that enhances removal characteristics for copper layers. In one embodiment, the slurry has a pH between about 6 and about 9.

Title
Copper chemical mechanical polishing slurry utilizing a chromate oxidant
Application Number
8/572082
Publication Number
5840629
Application Date
December 14, 1995
Publication Date
November 24, 1998
Inventor
Ronald A Carpio
Austin
TX, US
Agent
Arnold White & Durkee
Assignee
Sematech
TX, US
IPC
C09K 13/00
H01L 21/302
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