05837155 is referenced by 60 patents and cites 2 patents.

An insulating resin composition for the build-up of multilayer circuits by the procedure of copper foil lamination and a method for the production of a multilayer printed circuit board by the use of the insulating resin composition are disclosed. The insulating resin composition comprises at least one species of epoxy resin having a softening point of not more than 110.degree. C., a monomer or an oligomer possessing an unsaturated double bond, an epoxy resin curing agent, and a photopolymerization initiator. The insulating resin composition is applied to a printed circuit board throughout the entire area thereof so as to cover conductor patterns formed thereon and then irradiated with UV light. Subsequently a copper foil is superposed on the applied layer of the insulating resin composition on the printed circuit board by means of a heated pressure roller to effect lamination thereof. The insulating resin composition is thermally cured to give a multilayer laminate and then the outer layer copper foil of the produced multilayer laminate is selectively etched to form a prescribed conductor pattern.

Insulating resin composition for build-up by copper foil lamination and method for production of multilayer printed circuit board using the composition
Application Number
Publication Number
Application Date
August 14, 1996
Publication Date
November 17, 1998
Eiji Takehara
Shoji Inagaki
Ronald P Kananen
Taiyo Ink Manufacturing
B44C 1/22
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