05832601 is referenced by 168 patents and cites 4 patents.

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Title
Method of making temporary connections between electronic components
Application Number
152812
Publication Number
5832601
Application Date
April 15, 1997
Publication Date
November 10, 1998
Inventor
Gaetan L Mathieu
Dublin
CA, US
Igor Y Khandros
Orinda
CA, US
Gary W Grube
Pleasanton
CA, US
Benjamin N Eldridge
Danville
CA, US
Agent
David J Larwood
Gerald E Linden
Assignee
Form Factor
CA, US
IPC
H01K 9/00
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