05806181 is referenced by 235 patents and cites 19 patents.

The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated from a semiconductor wafer.

Title
Contact carriers (tiles) for populating larger substrates with spring contacts
Application Number
152812
Publication Number
5806181
Application Date
January 24, 1997
Publication Date
September 15, 1998
Inventor
William D Smith
Castro Valley
CA, US
Thomas H Dozier
Livermore
CA, US
Gaetan L Mathieu
Livermore
CA, US
Benjamin N Eldridge
Danville
CA, US
Igor Y Khandros
Orinda
CA, US
Agent
Fenwick & West
Agent
Gerald E Linden
Assignee
FormFactor
CA, US
IPC
H05K 1/11
H01R 43/16
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