05802699 is referenced by 256 patents and cites 58 patents.

A connector for microelectronic elements includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Title
Methods of assembling microelectronic assembly with socket for engaging bump leads
Application Number
8/254991
Publication Number
5802699
Application Date
June 7, 1994
Publication Date
September 8, 1998
Inventor
A Christian Walton
Belmont
CA, US
Thomas H DiStefano
Monte Sereno
CA, US
John W Smith
Palo Alto
CA, US
Joseph Fjelstad
Sunnyvale
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H05K 3/34
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