05800184 is referenced by 73 patents and cites 25 patents.

The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to be tested and/or burned-in and a test or burn-in system. A method for such burn-in and/or test or electrical interconnection is also disclosed.

The invention also encompasses an apparatus and a method that can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, etc., that is to be contained in and part of a system.

Title
High density electrical interconnect apparatus and method
Application Number
207768
Publication Number
5800184
Application Date
December 11, 1995
Publication Date
September 1, 1998
Inventor
Charles Russell Tompkins Jr
Poughkeepsie
NY, US
Joseph Michael Sullivan
Wappingers Falls
NY, US
Lewis Sigmund Goldmann
Bedford
NY, US
Emanuele Frank Lopergolo
Marlboro
NY, US
Agent
Aziz M Ahsan
Ira D Blecker
Assignee
International Business Machines Corporation
NY, US
IPC
H01R 9/09
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