05798564 is referenced by 31 patents and cites 4 patents.

The invention is to a double side semiconductor module (10) and an array (40) made up of a plurality of stacked modules (10). Each module (10) includes a plurality of substrates (11-15). A first substrate (13) has first and second sides, with one semiconductor device (16,25) having bond pads thereon (17,26), mounted on each of said first and second sides. At least one additional substrate (12,14) having a central opening (12b,14b), is placed on each of said first and second sides with the semiconductor device (16,25) mounted in the central opening (12b,14b). A plurality of solder pins (11a-15a), associated with each of said substrates (11-15) are connected to contact pads (17,26) on the semiconductor devices (16,25), and extend from and to openings in said substrates (11-15).

Title
Multiple chip module apparatus having dual sided substrate
Application Number
8/770884
Publication Number
5798564
Application Date
December 20, 1996
Publication Date
August 25, 1998
Inventor
Jing Sua Goh
Singapore
SG
Kian Teng Eng
Singapore
SG
Agent
Richard L Donaldson
W James Brady III
Mark E Courtney
Assignee
Texas Instruments Incorporated
TX, US
IPC
H01L 23/02
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