05796591 is referenced by 117 patents and cites 16 patents.

A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct chip mount. The chip has at least one solder ball with a cap of low melting point metal. The surface of the carrier has electrical features that are directly connected to the low melting point metal on the solder ball of the chip to form the eutectic and this way the chip is directly attached to the carrier.

Title
Direct chip attach circuit card
Application Number
8/476472
Publication Number
5796591
Application Date
June 7, 1995
Publication Date
August 18, 1998
Inventor
Kenneth Michael Fallon
Vestal
NY, US
Hormazdyar Minocher Dalal
Milton
NY, US
Agent
Aziz M Ahsan
Ira D Blecker
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/92
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