05783870 is referenced by 137 patents and cites 11 patents.

Stackable ball grid array packages are disclosed, wherein a plurality of separate ball grid array packages may be stacked, one on top of another, and interconnected by conductive terminals located on opposite surfaces of each of the ball grid array packages. Thus, the mounting of ball grid array packages on a printed circuit board may be conducted in three dimensions rather than two dimensions, requiring considerably less printed circuit board surface area and reducing parasitic inductances and capacitances between the terminals of the stacked ball grid array packages. An air gap is formed between adjacent, stacked packages for cooling. Connections between adjacent packages are made by conductive epoxy and noble metal balls.

Title
Method for connecting packages of a stacked ball grid array structure
Application Number
405486
Publication Number
5783870
Application Date
November 14, 1995
Publication Date
July 21, 1998
Inventor
Joseph O Smith
Morgan Hill
CA, US
Shahram Mostafazadeh
Santa Clara
CA, US
Agent
Skjerven Morrill MacPherson Franklin & Friel
Agent
Edward C Kwok
Assignee
National Semiconductor Corporation
CA, US
IPC
H01L 25/00
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