05772451 is referenced by 372 patents and cites 14 patents.

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive a LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate. In an embodiment intended to receive a BGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate.

Title
Sockets for electronic components and methods of connecting to electronic components
Application Number
152812
Publication Number
5772451
Application Date
October 18, 1995
Publication Date
June 30, 1998
Inventor
Gaetan L Mathieu
Dublin
CA, US
Igor Y Khandros
Orinda
CA, US
Gary W Grube
Pleasanton
CA, US
Benjamin N Eldridge
Danville
NY, US
Thomas H Dozier II
Carrolton
TX, US
Agent
Gerald E Linden
David J Larwood
Assignee
Form Factor
CA, US
IPC
H01R 4/58
View Original Source