05770347 is referenced by 16 patents and cites 9 patents.

A photocurable and thermosetting coating composition which can be diluted with water is disclosed. This composition comprises a photopolymerizable resin having a number-average molecular weight in the range of from 500 to 50,000 and containing an aprotic ammonium salt-containing moiety in a proportion of from 0.2 to 4.0 mols per kilogram of the resin, a photopolymerization initiator, a thermosetting component, and a diluent. The photopolymerizable resin is obtained by the reaction of a polymer possessing a tertiary amino group with a monocarboxylic acid and a monoepoxy compound either or both thereof possessing a polymerizable unsaturated double bond. As the thermosetting component, at least one member selected from the group consisting of amino resins, cyclocarbonate compounds, blocked isocyanate compounds, and epoxy resins is used. A tack-free coating film is obtained by applying this composition to a printed circuit board and drying the applied layer of the composition. A delicate resist pattern can be formed by exposing the coating film to an actinic radiation and developing the unexposed areas of the coating film with water or a dilute aqueous acid solution. By thermally curing the patterned resist film, a solder resist film excelling in various properties expected of a solder resist is obtained.

Title
Photocurable and thermosetting coating composition and method for formation of solder mask for printed circuit board
Application Number
8/555785
Publication Number
5770347
Application Date
November 9, 1995
Publication Date
June 23, 1998
Inventor
Kyo Ichikawa
Niiza
JP
Kazunobu Fukushima
Hatoyama-machi
JP
Teruo Saitoh
Iwatsuki
JP
Agent
Ronald P Kananen
Assignee
Taiyo Ink Manufacturing
JP
IPC
G03F 7/038
G03F 7/032
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