An electrical interconnection between a flip chip and a substrate. The interconnection includes a substrate having conductive pads to which wire bumps are attached. Each wire bump includes an elastically deformable stub section attached to the ball section, and a pointed tip. The pointed tip pierces a soft conductive layer located on a conductive pads of a flip chip. The elastic deformation of the stub section provides for consistent electrical connections between the flip chip and the substrate when the flip chip and the substrate are non-planar. An adhesive is located between the flip chip and the substrate and encompasses the wire bumps.