05764486 is referenced by 63 patents and cites 4 patents.

An electrical interconnection between a flip chip and a substrate. The interconnection includes a substrate having conductive pads to which wire bumps are attached. Each wire bump includes an elastically deformable stub section attached to the ball section, and a pointed tip. The pointed tip pierces a soft conductive layer located on a conductive pads of a flip chip. The elastic deformation of the stub section provides for consistent electrical connections between the flip chip and the substrate when the flip chip and the substrate are non-planar. An adhesive is located between the flip chip and the substrate and encompasses the wire bumps.

Title
Cost effective structure and method for interconnecting a flip chip with a substrate
Application Number
8/728876
Publication Number
5764486
Application Date
October 10, 1996
Publication Date
June 9, 1998
Inventor
Rajendra D Pendse
Fremont
CA, US
Agent
Brian R Short
Assignee
Hewlett Packard Company
CA, US
IPC
H01R 9/09
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