An IC socket is provided for obtaining a contact pressure between a contact of a socket body and a lead of an IC package placed on the contact by pressing down an IC package body or the IC lead by an IC presser. The IC socket comprises a cover movably mounted on an upper portion of the socket body for upward and downward movement, and a pressing lever. The pressing lever is axially pivotably supported with respect to the socket body, an external end of the pressing lever being linked to the cover so as to be moved upwardly and downwardly in response to the upward and downward movement of the cover. An internal end of the pressing lever is moved upwardly and downwardly but in opposite directions in response to the upward and downward movement of the cover through a linking portion at the external end of the pressing lever so as to be brought into and out of engagement with an upper surface of the IC body or IC lead, thereby pushing down the IC body or IC lead or releasing the push-down force applied to the IC body or IC lead. The pressing lever is supported such that the pressing lever can slide forwardly and backwardly, and the pressing lever is moved outwardly so as to be spaced away from the IC body and IC lead when the external end of the pressing lever is caused to move downwardly by the downward movement of the cover through the linking portion.