05745984 is referenced by 342 patents and cites 8 patents.

A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

Title
Method for making an electronic module
Application Number
8/500671
Publication Number
5745984
Application Date
July 10, 1995
Publication Date
May 5, 1998
Inventor
Theresa Ann Sitnik Nieters
Clifton Park
NY, US
Herbert Stanley Cole Jr
Burnt Hills
NY, US
Agent
Geoffrey H Krauss
Brian J Rees
Assignee
Martin Marietta Corporation
MD, US
IPC
H05K 3/32
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