05726493 is referenced by 351 patents and cites 15 patents.

A semiconductor device or a semiconductor device unit having a ball-grid-array type package structure, comprises a semiconductor element, a base having a mounting surface and a connection surface opposite to each other, the semiconductor element being mounted on the mounting surface, a plurality of balls which function as external connection terminals being provided on the connection surface, a sealing resin sealing the semiconductor element, and an electrically conductive electrode member, a first end of the electrode member being electrically connected to the semiconductor element on the mounting surface of the base, a second end of the electrode member being electrically connective to an outer terminal. An electrically conductive pin which can pass through the sealing resin can be used as the electrode member. Even after the semiconductor device is mounted on a circuit board, a test on the semiconductor element can be conducted. Also, a reliability of electric appliances and a heat release efficiency can be improved.

Title
Semiconductor device and semiconductor device unit having ball-grid-array type package structure
Application Number
489932
Publication Number
5726493
Application Date
February 24, 1997
Publication Date
March 10, 1998
Inventor
Masashi Takenaka
Kawasaki
JP
Taturou Yamashita
Kagoshima
JP
Agent
Armstrong Westerman Hattori McLeland & Naughton
Assignee
Fujitsu
JP
IPC
H01L 23/52
H01L 29/40
H01L 23/02
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