05723361 is referenced by 20 patents and cites 11 patents.

A method for fabricating an integrate circuit capacitor having a dielectric layer comprising BST with excess A-site and B-site materials such as barium and titanium added. An organometallic or metallic soap precursor solution is prepared comprising a stock solution of BST of greater than 99.999% purity blended with excess A-site and B-site materials such as barium and titanium such that the barium is in the range of 0.01-100 mol %, and such that the titanium is in the range of 0.01-100 mol %. A xylene exchange is then performed to adjust the viscosity of the solution for spin-on application to a substrate. The precursor solution is spun on a first electrode, dried at 400.degree. C. for 2 to 10 minutes, then annealed at 650.degree. C. to 800.degree. C. for about an hour to form a layer of BST with excess titanium. A second electrode is deposited, patterned, and annealed at between 650.degree. C. to 800.degree. C. for about 30 minutes. The resultant capacitor exhibits an enlarged dielectric constant with little change in leakage current.

Title
Thin films of ABO.sub.3 with excess A-site and B-site modifiers and method of fabricating integrated circuits with same
Application Number
807439
Publication Number
5723361
Application Date
July 5, 1994
Publication Date
March 3, 1998
Inventor
Michael C Scott
Colorado Springs
CO, US
Carlos A Paz De Araujo
Colorado Springs
CO, US
Masamichi Azuma
Colorado Springs
CO, US
Agent
Duft Graziano & Forest P C
Assignee
Matsushita Electronics Corporation
JP
Symetrix Corporation
CO, US
IPC
C23C 18/12
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