05717556 is referenced by 94 patents and cites 23 patents.

In a printed-wiring board, first and second hard substrates each having electronic components mounted thereon are connected through a flexible substrate interposed therebetween. A circuit pattern printed on each of the hard and flexible substrates electrically connects the electronic components mounted on the hard substrates through the flexible substrate. The circuit pattern includes a plurality of parallel-connected signal lines. The parallel-connected signal lines are spatially separated on the flexible substrate, and the both ends of the parallel-connected signal lines are located in the hard substrates, respectively. A single signal line of the circuit pattern branches on one hard substrate into the parallel-connected signal lines, which extend through the flexible substrate and are converged to a single signal line on the other hard substrate.

Title
Printed-wiring board having plural parallel-connected interconnections
Application Number
8/638939
Publication Number
5717556
Application Date
April 25, 1996
Publication Date
February 10, 1998
Inventor
Keiichirou Yanagida
Tokyo
JP
Agent
Whitham Curtis Whitham & McGinn
Assignee
NEC Corporation
JP
IPC
H01R 9/09
H05K 1/11
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