An IC socket is provided for obtaining a contact pressure between a contact of a socket body and a lead of an IC package placed on the contact by pressing down an IC package body or the IC lead by an IC presser. The IC socket comprises a cover movably mounted on an upper portion of the socket body for upward and downward movement, and a pressing lever. The pressing lever being axially movably supported for inward end outward movement and pivotally supported for upward and downward movement with respect to the socket body. An external end of the pressing lever is linked to the cover such that the pressing lever can move upwardly and downwardly in response to the vertical upward and downward movement of the cover. An inner end of the pressing lever is moved inwardly and outwardly while moving upwardly and downwardly in response to but in a direction opposite to the upward and downward movement of the external end of the pressing lever, so as to be brought into and out of engagement with an upper surface of the IC lead, thereby exerting a push-down force against or removing the push-down force from the IC body or the IC lead.