05683565 is referenced by 1 patents and cites 4 patents.

A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.

Title
Electroplating process
Application Number
488943
Publication Number
5683565
Application Date
May 23, 1996
Publication Date
November 4, 1997
Inventor
Mark J Kapeckas
Worcester
MA, US
Edward C Couble
Brockton
MA, US
Carl J Colangelo
New Bedford
MA, US
Jeffrey P Burress
Milford
MA, US
Steven M Florio
Hopkinton
MA, US
Agent
Robert L Goldberg
Assignee
Shipley Company L L C
MA, US
IPC
H01B 1/04
C23C 5/10
C25D 5/02
C25D 15/00
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