05681757 is referenced by 84 patents and cites 13 patents.

The present invention relates to the process of die bonding semiconductor integrated circuit microchips with adhesive deposited from microjets in a precise pattern. Print-head technology equivalent to that used in inkjet printers is used to apply the adhesive substance (most commonly an epoxy). The use of microjets in an "array printhead" to deposit an adhesive pattern provides advantages in the ability to control the location and size of the adhesive droplets with a high degree of precision. The method also provides for individual actuation of the microjets providing the ability to rapidly change from pattern to pattern without the need to change and clean heads and equipment or to provide multiple heads. The method has application in standard die bonding as well as "flip-chip" processes using "bumped dies." The high degree of precision available allows adhesive to be printed in between the solder bumps of a "bumped die" providing stronger bonding and an underfill without interfering with the electrical connection created by the solder bumps. Also disclosed is a novel method for accomplishing a "flip-chip" process in which the array printhead is used to print conductive epoxy directly on the interconnect pads of the die, replacing the solder bumps of a standard "bumped die." The die is then aligned and placed onto a substrate, with the conductive epoxy serving as both the conductive path and a strong adhesive bonding agent.

Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
Application Number
Publication Number
Application Date
April 29, 1996
Publication Date
October 28, 1997
Donald J Hayes
Harris Tucker & Hardin P C
MicroFab Technologies
H01L 21/68
H01L 21/603
H01L 21/58
H01L 21/56
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