05679977 is referenced by 333 patents and cites 110 patents.

Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.

Title
Semiconductor chip assemblies, methods of making same and components for same
Application Number
765928
Publication Number
5679977
Application Date
April 28, 1993
Publication Date
October 21, 1997
Inventor
Thomas H Distefano
Bronxville
NY, US
Igor Y Khandros
Peekskill
NY, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/52
H01L 23/48
View Original Source