05677566 is referenced by 283 patents and cites 13 patents.

A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive leads. The electrode bumps protrude from the encapsulating material for connection to an external circuit.

Title
Semiconductor chip package
Application Number
8/436522
Publication Number
5677566
Application Date
May 8, 1995
Publication Date
October 14, 1997
Inventor
Jerry M Brooks
Caldwell
ID, US
Jerrold L King
Boise
ID, US
Agent
Ormiston Korfanta Dunbar & Holland PLLC
Assignee
Micron Technology
ID, US
IPC
H01L 23/495
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