05674785 is referenced by 286 patents and cites 26 patents.

A method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided. The package body includes a die mounting location and an interconnect opening that aligns with the bond pads on the die. Electrical interconnects, such as wire bonds, are formed through the interconnect opening to establish electrical communication between the bond pads on the die and the conductors on the package body. The conductors on the package body can include solder bumps to permit the package to be flip chip mounted to a supporting substrate such as a printed circuit board or to be mounted in a chip-on-board configuration. The package can be fabricated by bulk micro-machining silicon wafers to form the package bodies, attaching the dice to the package bodies, and then singulating the wafer. Alternately the package body can be formed of a FR-4 material. In addition, multiple dice can be attached to a package body to form a multi-chip module.

Title
Method of producing a single piece package for semiconductor die
Application Number
8/563191
Publication Number
5674785
Application Date
November 27, 1995
Publication Date
October 7, 1997
Inventor
Warren M Farnworth
Nampa
ID, US
Alan G Wood
Boise
ID, US
Salman Akram
Boise
ID, US
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
H01L 21/60
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