05670067 is referenced by 29 patents and cites 20 patents.

An apparatus for cutting a wiring on a printed wiring board using a laser beam includes a laser oscillator for emitting a laser beam along a main optical path, a multiaxis positioning apparatus for changing the three-dimensional coordinates of a printed wiring board, an X-Y adjustment apparatus for adjusting two-dimensional coordinates, perpendicular to the main optical path, an apparatus for optically measuring a size of a wiring to be cut, and a control apparatus for controlling beam parameters of the laser beam in accordance with the measured size.

Title
Apparatus for laser cutting wiring in accordance with a measured size of the wiring
Application Number
8/238735
Publication Number
5670067
Application Date
May 5, 1994
Publication Date
September 23, 1997
Inventor
Hiroshi Ikeda
Kawasaki
JP
Masateru Koide
Kawasaki
JP
Agent
Armstrong Westerman Hattori McLeland & Naughton
Assignee
Fujitsu
JP
IPC
H05K 3/02
B23K 26/02
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