05659201 is referenced by 193 patents and cites 10 patents.

High conductivity interconnection lines are formed of high conductivity material, such as copper, employing barrier layers impervious to the diffusion of copper atoms. Higher operating speeds are obtained with conductive interconnection lines, preferably copper interconnection lines, formed above the wire bonding layer.

Title
High conductivity interconnection line
Application Number
8/463805
Publication Number
5659201
Application Date
June 5, 1995
Publication Date
August 19, 1997
Inventor
Donald L Wollesen
Saratoga
CA, US
Agent
Lowe Price LeBlanc & Becker
Assignee
Advanced Micro Devices
CA, US
IPC
H01L 23/48
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