05658985 is referenced by 12 patents and cites 13 patents.

Thermoplastic molding composition, containing: A) 5-95 weight percent of a thermoplastic homo-, co-, or terpolymer of styrene, alpha-methylstyrene, ring-substituted styrene, methyl methacrylate, acrylonitrile, methacrylonitrile, maleic anhydride, N-substituted maleimide, vinyl acetate or mixtures thereof; B) 5-95 weight % of a graft polymer of B.1) 5-90 parts by weight of styrene, alpha-methylstyrene, ring-substituted styrene, methyl methacrylate, acrylonitrile, methacrylonitrile, maleic anhydride, N-substituted maleimide, vinyl acetate or mixtures thereof on B.2) 95-10 parts by weight of a rubber with a glass transition temperature .ltoreq. 10.degree. C; and C) 0.1-10 parts bye weight per 100 parts by weight of A+B of one or more EPM and/or EPDM rubbers.

Title
ABS moulding compounds with improved yield stress
Application Number
559721
Publication Number
5658985
Application Date
February 16, 1996
Publication Date
August 19, 1997
Inventor
Karl Heinz Ott
Leverkusen
DE
Alfred Pischtschan
Kuerten
DE
Herbert Eichenauer
Dormagen
DE
Agent
Connolly and Hutz
Assignee
Bayer
DE
IPC
C08L 9/08
C08L 9/04
C08L 33/18
C08L 23/16
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