05644221 is referenced by 59 patents and cites 3 patents.

A method and apparatus for endpoint detection in removal of a film from a semiconductor wafer is provided, with a sensor for creating a signal responsive to the film removal process, a positive feedback amplifier coupled to the sensor, the positive feedback amplifier having a mode selector, and an analyzer coupled to the positive feedback amplifier.

Title
Endpoint detection for chemical mechanical polishing using frequency or amplitude mode
Application Number
8/620722
Publication Number
5644221
Application Date
March 19, 1996
Publication Date
July 1, 1997
Inventor
Arnold Halperin
Cortlandt Manor
NY, US
Steven George Barbee
Dover Plains
NY, US
Leping Li
Poughkeepsie
NY, US
Agent
Alison D Mortinger
Assignee
International Business Machines Corporation
NY, US
IPC
G01B 27/00
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